中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (8): 080406 . doi: 10.16257/j.cnki.1681-1070.2021.0816

• 微电子制造与可靠性 • 上一篇    下一篇

硅基微流道高效散热技术在宽带微波收发组件中的应用

向伟玮;张剑;卢茜;李阳阳;董乐   

  1. 中国电子科技集团公司第二十九研究所,成都 610036
  • 收稿日期:2021-04-08 出版日期:2021-08-11 发布日期:2021-07-07
  • 作者简介:向伟玮(1983—),男,四川成都人,博士,高级工程师,现从事宽带微波与微系统集成技术研究。

The Application of Silicon-Based MicrochannelHigh Efficiency Heat Dissipation Technology in Broadband Microwave TransceiverModule

XIANG Weiwei, ZHANG Jian, LU Qian, LI Yangyang, DONG Le   

  1. The 29thResearch Institute of China Electronics Technology Group Corporation,
  • Received:2021-04-08 Online:2021-08-11 Published:2021-07-07

摘要: 硅基微流道散热技术可以实现数百瓦每平方厘米以上的高效散热能力。开发了硅基微流道散热器,实现了600 W/cm2以上的高效散热能力。硅作为半导体材料,会影响微波功率芯片的接地性能。通过对硅基微流道散热器进行整体金属化处理,可使其满足宽带微波收发组件的应用要求。将硅基微流道散热器集成在大功率收发组件中,在2~6 GHz的频率范围内,组件能够正常工作,饱和输出功率大于40 dBm。

关键词: 硅基微流道, 高效散热, 宽带微波

Abstract: Silicon-based microchannel heat dissipation technology can achieve efficient cooling capacity of hundreds of watts per square centimeter. Silicon-based microchannel radiator which can realize the cooling capacity of more than 600 W/cm2 is fabricated. As semiconductor material, the parasitic effect of silicon will affect the grounding performance of microwave power chips. After integral metallization, the silicon microchannel radiator can meet the application requirements of broadband microwave transceiver module. Furthermore, silicon-based microchannel radiator is integrated into a high-power transceiver module. In the frequency range of 2~6 GHz, the module can work normally, and the saturated output power is more than 40 dBm.

Key words: silicon-basedmicrochannel, highefficiencyheatdissipation, broadbandmicrowave

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