基于硅通孔互连的芯粒集成技术研究进展
张爱兵, 李洋, 姚昕, 李轶楠, 梁梦楠
Research Progress of Chiplet Integration Technology Based on Through Silicon Via Interconnection
ZHANG Aibing, LI Yang, YAO Xin, LI Yi’nan, LIANG Mengnan
电子与封装
.
2024, (6): 60110
.
DOI: 10.16257/j.cnki.1681-1070.2024.0124
