大腔体陶瓷封装中平行缝焊的密封可靠性设计

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丁荣峥,田爽,肖汉武

Sealing Reliability Design of Parallel Seam Welding in Large Cavity Ceramic Package

DING Rongzheng, TIAN Shuang, XIAO Hanwu

电子与封装 . 2024, (10): 100201 . DOI: 10.16257/j.cnki.1681-1070.2024.0126