关键词: 陶瓷封装, 气密性, 平行缝焊, 封装设计, 密封可靠性

Abstract: With the increase of the size of the parallel seam welding cavity, especially in the medium temperature co-fired ceramic package and thin high temperature co-fired ceramic package, the sealing yield of parallel seam welding is relatively low and the reliability of air tightness is relatively poor. By analyzing the reasons of sealing failure of alumina ceramic package, an optimized structure design of kovar frame and lid of parallel seam welding is proposed to improve sealing reliability. A certain type of DSP circuit using FC-CPGA570 package is taken as an example for simulation and verification. By reducing the residual thermal stress of brazing, increasing the buffer structure, and adopting the lightweight design of lid, very good sealing yield and good sealing reliability are achieved, thus providing a reference for the air tightness design and reliability improvement of similar products and even low temperature co-fired ceramic package.

Key words: ceramic package, air tightness, parallel seam welding, package design, sealing reliability