金丝球键合第二焊点的加固工艺与可靠性研究

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骞涤

Research on Reinforcement Process and Reliability of the Second Solder Joint for Gold Wire Ball Bonding

QIAN Di

电子与封装 . 2024, (10): 100202 . DOI: 10.16257/j.cnki.1681-1070.2024.0130