关键词: 封装技术, 金丝球键合, 第二焊点, BBOS工艺

Abstract: In the thick film circuit, the bonding area of the second solder joint of the gold wire ball bonding is usually composed of thick film gold layer, aluminum transition plate and nickel plated lead. There are differences in the roughness, defect size and hardness of the bonding area materials, which puts forward higher requirements on the output accuracy of the bonding equipment, the shape of capillary and the bonding parameters. The second solder joint adopts the wedge-shaped fishtail welding process, which is easy to have the problems of unsoldering and insufficient tensile strength. Therefore, the second solder joint is reinforced by processes such as bonding ball on stitch (BBOS) and short wire patching. Through finite element simulation methods such as static analysis and random vibration analysis, combined with reliability experiments, the second solder joints under different process conditions are analyzed and compared. The results show that BBOS process is the optimal choice.

Key words: packaging technology, gold wire ball bonding, the second solder joint, BBOS process