芯粒集成工艺技术发展与挑战<sup>*</sup>

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陈浪,杜建宇,汪琪,张盼,张驰,王玮

Development and Challenges of Chiplet Integration Technology

CHEN Lang, DU Jianyu, WANG Qi, ZHANG Pan, ZHANG Chi, WANG Wei

电子与封装 . 2024, (10): 100203 . DOI: 10.16257/j.cnki.1681-1070.2024.0131