一种倒装芯片二维封装过程焊点缺陷原位监测方法

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周彬,乔健鑫,苏允康,黄文涛,李隆球

Method for in-Situ Monitoring of Solder Joint Defects in the Two-Dimensional Packaging Process of Flip Chip

电子与封装 . 2024, (10): 100601 . DOI: 10.16257/j.cnki.1681-1070.2024.0150