面向大功率器件散热的金刚石基板微流道仿真研究*
孙浩洋，姬峰，张晓宇，兰梦伟，李鑫宇，冯青华，兰元飞，王明伟
Simulation Study on Diamond Substrate Microfluidic Channel for Heat Dissipation of High Power Devices
SUN Haoyang, JI Feng, ZHANG Xiaoyu, LAN Mengwei, LI xinyu, FENG Qinghua, LAN Yuanfei, WANG Mingwei
电子与封装
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2024, (11): 110204
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DOI: 10.16257/j.cnki.1681-1070.2024.0159
