In掺杂Sn-1Ag-0.7Cu-3Bi-1.5Sb-<i>x</i>In/Cu互连结构在热载荷下的损伤

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李泉震,王小京

In-Doped Sn-1Ag-0.7Cu-3Bi-1.5Sb-xIn/Cu Interconnect Structure Damage under Thermal Loading

LI Quanzhen, WANG Xiaojing

电子与封装 . 2024, (12): 120101 . DOI: 10.16257/j.cnki.1681-1070.2024.0178