第三代半导体封装结构设计及可靠性评估技术的研究进展
郑佳宝, 李照天, 张晨如, 刘俐
Research Progress of Packaging Structure Design and Reliability
Evaluation Technology for Third-Generation Semiconductors
ZHENG Jiabao, LI Zhaotian, ZHANG Chenru, LIU Li
电子与封装
.
0, (): 0
-0
.
DOI: 10.16257/j.cnki.1681-1070.2025.0053
