功率器件封装纳米浆料材料、低温烧结工艺及机理研究进展综述
王一平, 于铭涵, 王润泽, 佟子睿, 冯佳运, 田艳红,
Review on Nano Paste Materials, Low Temperature Sintering Processes and Mechanisms for Power Device Packaging
WANG Yiping, YU Minghan, WANG Runze, TONG Zirui, FENG Jiayun, TIAN Yanhong,
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2025.0058
