基于低温铜烧结技术的大功率碳化硅模块电热性能表征
闫海东, 蒙业惠, 刘昀粲, 刘朝辉
Characterization of Electrothermal
Properties of High-Power Silicon Carbide Modules Based on Low-Temperature Copper
Sintering Technology
YAN Haidong, MENG Yehui, LIU Yuncan, LIU Chaohui
电子与封装
.
0, (): 0
-0
.
DOI: 10.16257/j.cnki.1681-1070.2025.0063
