塑封集成电路焊锡污染影响与分析

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邱志述, 胡敏

Impact and Analysis of Solder Contamination on Plastic Encapsulated Integrated Circuits

QIU Zhishu, HU Min

电子与封装 . 0, (): 0 -0 . DOI: 10.16257/j.cnki.1681-1070.2025.0062