电子与封装
• 封装、组装与测试 • 下一篇
邱志述，胡敏
收稿日期:
修回日期:
出版日期:
发布日期:
通讯作者:
QIU Zhishu, HU Min
Received:
Revised:
Online:
Published:
摘要： 塑封IC受潮汽侵蚀造成离子污染而引起的可靠性问题较为常见，由PCB焊锡污染而引起的则不多。介绍印刷电路板焊锡污染导致IC可靠性失效的实际案例，指出焊锡污染发生的条件，通过对IC塑封体元素成分的分析，得出焊锡污染可能导致IC可靠性失效。通过对失效品加热及再次老化，让IC出现变好和再次失效。原理上解释了焊锡污染IC封装塑封体是不可恢复的，在特定条件下还可能会再次失效。对表面贴装技术（SMT）工程师给出建议，以避免类似焊锡污染IC导致可靠性失效。
关键词: 回流焊, 波峰焊, PCB, SMT
Abstract: Molded integrated circuits（IC）reliability issue caused by ionic contamination due to package moisture erosion is more common, due to printed circuit board solder contamination is not much. Describes the actual case of IC reliability failure caused by printed circuit board solder contamination, point out the conditions for the occurrence of solder contamination, and conclude that solder contamination may lead to IC reliability failure by analyzing the elemental composition of IC molding body. By heating the failed product and aging it again, the IC appears to get better and fail again. In principle, it explains that solder contamination of IC package is not recoverable and may fail again under certain conditions. Suggestions are given to SMT engineers to avoid reliability failures caused by similar solder contaminated IC.
Key words: reflow soldering, wave soldering, PCB, SMT
邱志述, 胡敏. 塑封集成电路焊锡污染影响与分析[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2025.0062.
QIU Zhishu, HU Min. Impact and Analysis of Solder Contamination on Plastic Encapsulated Integrated Circuits[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2025.0062.
0 / / 推荐
导出引用管理器 EndNote|Reference Manager|ProCite|BibTeX|RefWorks
链接本文: https://ep.org.cn/CN/10.16257/j.cnki.1681-1070.2025.0062
