一种MEMS封装LGA 2×2产品切割后点胶工艺方法研究

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薛岫琦, 郑志荣

Research on Dispensing Glue Process Method After Cutting LGA 2X2 Products in MEMS Package

XUE Xiuqi, ZHENG Zhirong

电子与封装 . 0, (): 0 -0 . DOI: 10.16257/j.cnki.1681-1070.2025.0061