关键词: 封装技术, MEMS, 点胶

Abstract: The general process of dispensing glue after molding for MEMS is introduced. The problems in the process of dispensing glue of MEMS package products after package sawed are suggested. Experiments are carried out for the process and the method of mathematical statistics is used for analysis. The dispensing glue process method of MEMS package product after package sawed is researched, the problems in the implementation process of dispensing glue are found out, and the optimization method of dispensing glue after package sawed is implemented. Finally, the feasibility of the dispensing method in the process is verified by mathematical statistics. The CPK of the glue diameter and glue position are both greater than 1.33. Compared with the original method, the accuracy of this method is significantly improved. The method meets the requirements of dispensing glue after package sawed in the process.

Key words: package technology, MEMS, dispensing glue