混合键合界面接触电阻及界面热阻研究进展
吴艺雄, 杜韵辉, 陶泽明, 钟毅, 于大全,
Research Progress on
Interfacial Contact Resistance and Thermal Boundary Resistance of Hybrid
Bonding
WU Yixiong, DU Yunhui, TAO Zeming, ZHONG Yi, YU Daquan,
电子与封装
.
0, (): 0
-0
.
DOI: 10.16257/j.cnki.1681-1070.2025.0069
|
|
|
