关键词: 先进封装, 高密度互连, 界面热阻, 接触电阻, 开尔文结构

Abstract: As semiconductor technology advances towards higher levels of integration and performance, hybrid bonding technology has shown great potential in the field of integrated circuits as an advanced packaging method. This paper reviews the research progress on interface contact resistance and thermal resistance in hybrid bonding, exploring its application in 3D integrated chips, with a focus on the technological breakthroughs in reducing resistance and optimizing thermal resistance. Key factors influencing interface resistance and thermal resistance are summarized, and the impact of various processes on performance is evaluated. Factors such as interface treatment, surface roughness, cleaning time, and annealing process have a significant impact on contact resistance, while interface materials and multiphysical coupling effects play an important role in optimizing thermal resistance. Furthermore, the advancement of fine-pitch hybrid bonding technology has driven the increase in chip packaging density, but as the pitch continues to shrink, issues such as interface stress and alignment errors still need to be further addressed.

Key words: advanced packaging, high density interconnection, thermal boundary resistance, contact resistance, kelvin structure