IPM封装模块焊接与金线键合工艺研究
王仙翅, 刘洪伟, 刘晓鹏, 蔡钊, 朱亮亮, 杜隆纯,
Research on Welding and Gold Wire Bonding Process of IPM Packaging Modules
WANG Xianchi, LIU Hongwei, LIU Xiaopeng, CAI Zhao, ZHU Liangliang, DU Longchun,
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2025.0079
