大功率器件基板散热技术研究进展*
兰梦伟,姬峰,王成伟,孙浩洋,杜建宇,徐晋宏,王晶,张鹏哲,王明伟
Research Progress on Substrate Heat Dissipation Technology for High Power Devices
LAN Mengwei, JI Feng, WANG Chengwei, SUN Haoyang, DU Jianyu, XU Jinhong, WANG Jing, ZHANG Pengzhe, WANG Mingwei
电子与封装
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2025, (3): 30111
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DOI: 10.16257/j.cnki.1681-1070.2025.0091
