大功率器件基板散热技术研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0091

摘要/Abstract

摘要： 电子器件正朝着高性能和小型化方向发展，频率、功率和集成度不断提高，其内部大功率芯片产生的热量急剧增加，不仅影响器件工作效率和稳定性，还直接关系到整个系统的安全性和可靠性。大功率器件产生的热量主要依靠封装基板提供通道耗散，因此研究基板散热技术尤为重要。详细介绍了金属基板、陶瓷基板、复合材料基板等常规基板散热技术和微流道散热技术、相变散热技术、热电散热技术等新型基板散热技术的研究现状。其中，歧管微流道金刚石基板以及多种散热方式协同应用基板具备优异的冷却性能，有望大幅提高电子器件的功率和寿命。通过分析各种基板散热技术，期望为相关领域的研究和应用提供有价值的参考。

关键词: 大功率器件, 基板散热, 冷却性能

Abstract: Electronic devices are developing towards high performance and miniaturization, with the continuous improvement of frequency, power and integration, the heat generated by high power chips inside electronic increases rapidly, which not only affects the efficiency and stability of the devices, but also directly relates to the safety and reliability of the whole system. The heat generated by high power devices mainly relies on the channels provided by the package substrate to dissipate, so it is particularly important to study the substrate heat dissipation technology. The research status of heat dissipation technologies of conventional substrates such as metal substrates, ceramic substrates, and composite substrates and new substrate heat dissipation technologies such as microfluidic heat dissipation technology, phase change heat dissipation technology, thermoelectric heat dissipation technology are introduced in detail. Among them, the manifold microchannel diamond substrate and multiple heat dissipation methods synergistically applied substrate have excellent cooling performance, which is expected to greatly improve the power and life of electronic devices. By analyzing various substrate heat dissipation technologies, it is expected to provide valuable references for research and applications in related fields.

Key words: high power devices, substrate heat dissipation, cooling performance

中图分类号:

TN305.94

兰梦伟,姬峰,王成伟,孙浩洋,杜建宇,徐晋宏,王晶,张鹏哲,王明伟. 大功率器件基板散热技术研究进展^*[J]. 电子与封装, 2025, 25(3): 030111 .

LAN Mengwei, JI Feng, WANG Chengwei, SUN Haoyang, DU Jianyu, XU Jinhong, WANG Jing, ZHANG Pengzhe, WANG Mingwei. Research Progress on Substrate Heat Dissipation Technology for High Power Devices[J]. Electronics & Packaging, 2025, 25(3): 030111 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

大功率器件基板散热技术研究进展^*

Research Progress on Substrate Heat Dissipation Technology for High Power Devices

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