基于FOPLP工艺多I/O芯片封装的可靠性研究及优化*
江京,刘建辉,陶都,宋关强,李俞虹,钟仕杰
Reliability Study and Optimization of Multi-I/O Chip Packaging Based on FOPLP Process
JIANG Jing, LIU Jianhui, TAO Du, SONG Guanqiang, LI Yuhong, ZHONG Shijie
电子与封装
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2025, (2): 20202
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DOI: 10.16257/j.cnki.1681-1070.2025.0022
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