关键词: 扇出型板级封装, 失效分析, 可靠性, 热应力仿真

Abstract: With the advancement of packaging process, fan-out plate level packaging (FOPLP) process has attracted much attention due to its high integration, low cost, better performance and wider application areas. The reliability of multi-I/O chip products packaged based on FOPLP process is studied systematically. The leakage problem of products in bias high acceleration temperature and humidity stress test (BHAST) is explored and analyzed. According to the failure analysis results, the focus is placed on the climbing glue height and product stress. At the same time, the silver glue content and fixed processing parameters for improving products are verified by the design of experiment (DOE). Aiming at the stress problem of multi-I/O chip, simulation is used to optimize the stress distribution. The products successfully pass the BHAST reliability project and meet the BHAST reliability requirements of continuous operation for 264 h at 130 ℃ and 85 %RH, which is of great significance for improving the overall performance and market competitiveness of multi-I/O products.

Key words: fan-out panel level packaging, failure analysis, reliability, thermal stress simulation