GaN芯片封装技术研究进展与趋势*
宋海涛,王霄,龚平,朱霞,李杨,刘璋成,闫大为,陈治伟,尤杰,敖金平
Research Progress and Trend of GaN Chip Packaging Technology
SONG Haitao, WANG Xiao, GONG Ping, ZHU Xia, LI Yang, LIU Zhangcheng, YAN Dawei, CHEN Zhiwei, YOU Jie, AO Jinping
电子与封装
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2025, (3): 30112
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DOI: 10.16257/j.cnki.1681-1070.2025.0104
