GaN芯片封装技术研究进展与趋势*

doi:10.16257/j.cnki.1681-1070.2025.0104

摘要/Abstract

摘要： 作为第三代半导体材料，GaN因其高电子迁移率、高击穿场强等优异特性，正被广泛应用于高频、高功率电子器件。然而，其封装技术面临诸如热管理、电气性能优化以及封装可靠性等挑战，同时还需要满足更紧凑、更集成的需求。重点讨论了目前GaN芯片封装的多种解决方案，包括晶体管外形（TO）封装、四边扁平无引线（QFN）封装等分立器件封装结构，晶圆级封装（WLP）、多芯片模块（MCM）合封器件封装结构以及诸多先进封装技术。分析了封装技术的发展趋势，如集成化、模块化封装，以及面向高频、高功率应用的优化方法。随着技术的不断突破，GaN封装有望在更高效、更可靠的方向上取得进一步进展，以满足不断增长的市场需求。

关键词: GaN, 芯片封装, 先进封装, 散热, 寄生电感, 3D集成

Abstract: As a third-generation semiconductor material, GaN is widely used in high-frequency and high-power electronic devices because of its excellent characteristics such as high electron mobility and high breakdown field strength. However, its packaging technology faces challenges such as thermal management, electrical performance optimization, and packaging reliability, as well as the need to be more compact and integrated. Various solutions for GaN chip packaging are discussed, including discrete device packaging structures of transistor outline (TO) packaging and quad-flat no-lead (QFN) packaging, closed device packaging structures of wafer-level packaging (WLP) and multi-chip module (MCM), and many advanced packaging technologies. The development trend of packaging technology is analyzed, such as integration, modular packaging, and optimization methods for high-frequency and high-power applications. With the continuous breakthrough of technology, GaN packaging is expected to make further progress in the direction of more efficient and more reliable to meet the growing market demand.

Key words: GaN, chip packaging, advanced packaging, heat dissipation, parasitic inductance, 3D integration

中图分类号:

TN305.94

宋海涛,王霄,龚平,朱霞,李杨,刘璋成,闫大为,陈治伟,尤杰,敖金平. GaN芯片封装技术研究进展与趋势^*[J]. 电子与封装, 2025, 25(3): 030112 .

SONG Haitao, WANG Xiao, GONG Ping, ZHU Xia, LI Yang, LIU Zhangcheng, YAN Dawei, CHEN Zhiwei, YOU Jie, AO Jinping. Research Progress and Trend of GaN Chip Packaging Technology[J]. Electronics & Packaging, 2025, 25(3): 030112 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

GaN芯片封装技术研究进展与趋势^*

Research Progress and Trend of GaN Chip Packaging Technology

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