先进封装中铜柱微凸点互连技术研究进展*
张冉远, 翁铭, 黄文俊, 张昱, 杨冠南, 黄光汉, 崔成强
Research Progress of Copper Pillar Micro-Bump Interconnect Technology in Advanced Packaging
ZHANG Ranyuan, WENG Ming, HUANG Wenjun, ZHANG Yu, YANG Guannan, HUANG Guanghan, CUI Chengqiang
电子与封装
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2025, (5): 50109
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DOI: 10.16257/j.cnki.1681-1070.2025.0141
