先进封装中铜柱微凸点互连技术研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0141

摘要/Abstract

摘要： 超高密度互连、三维异构集成是当前微电子技术发展的趋势，铜柱微凸点作为先进封装互连的核心技术，提供了高性能、多样化的应用方案。讨论了焊料铜柱微凸点互连的原理、特性及挑战，详细阐述了瞬态液相互连技术及固态扩散互连技术的研究进展，概述了纳米材料修饰铜柱微凸点互连的不同方案，分析了各类材料的互连特性及性能。最后总结展望了铜柱微凸点互连技术未来的发展方向。

关键词: 先进封装, 铜柱微凸点, 焊料, 纳米材料

Abstract: Ultra-high density interconnection and three-dimensional heterogeneous integration are the current development trends of microelectronics technology. Copper pillar micro-bumps, as the core technology of advanced packaging interconnections, provide high-performance and diversified application solutions. The principles, characteristics and challenges of solder copper pillar micro-bump interconnections are discussed, recent advancements in transient liquid-phase and solid-state diffusion interconnection technologies are described in detail, different schemes of nano-material-modified copper pillar micro-bump interconnections are outlined, and the interconnection characteristics and performance of various materials are analyzed. Finally, the future directions of copper pillar micro-bump interconnection technology are summarized.

Key words: advanced packaging, copper pillar micro-bump, solder, nano-material

中图分类号:

TN305.94

张冉远, 翁铭, 黄文俊, 张昱, 杨冠南, 黄光汉, 崔成强. 先进封装中铜柱微凸点互连技术研究进展^*[J]. 电子与封装, 2025, 25(5): 050109 .

ZHANG Ranyuan, WENG Ming, HUANG Wenjun, ZHANG Yu, YANG Guannan, HUANG Guanghan, CUI Chengqiang. Research Progress of Copper Pillar Micro-Bump Interconnect Technology in Advanced Packaging[J]. Electronics & Packaging, 2025, 25(5): 050109 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

先进封装中铜柱微凸点互连技术研究进展^*

Research Progress of Copper Pillar Micro-Bump Interconnect Technology in Advanced Packaging

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