中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
玻璃通孔化学镀金属化研究进展*
孙鹏,钟毅,于大全
Recent Progress in Electroless Plating Process for Metallization of Through Glass Via
SUN Peng, ZHONG Yi, YU Daquan
电子与封装 . 2025, (7): 70107 .  DOI: 10.16257/j.cnki.1681-1070.2025.0158