玻璃通孔化学镀金属化研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0158

摘要/Abstract

摘要： 随着摩尔定律逐渐达到物理极限，电子器件向“小、巧、精”发展的同时也对先进封装技术提出了更高的要求。玻璃基板由于具有优秀的高频应用能力、热膨胀系数灵活可调、成本低廉以及大尺寸超薄玻璃基板易于获取等优点，目前已受到国内外企业及科研院所的青睐。金属化工艺作为玻璃通孔（TGV）中的关键环节，决定了集成芯片电气连接的性能。当前，TGV金属化主要通过物理气相沉积(PVD)技术实现。但PVD工艺的成本高昂，沉积速度慢且处理高深宽比盲、通孔的效果差，使得通过湿法工艺对TGV进行金属化受到了广泛关注。针对此，阐述了TGV化学镀沉积机理并综述了近年来的研究现状及提升镀层与玻璃基板黏附性的关键技术，同时对未来发展方向提出见解。

关键词: 化学镀, 玻璃通孔, 黏附强度, 自组装, 金属氧化物

Abstract: As Moore's Law gradually approaches its physical limits, the development of electronic devices toward "smaller, thinner, and more precise" dimensions simultaneously imposes higher demands on advanced packaging technologies. Glass substrates have gained significant favor among domestic and foreign enterprises and research institutions due to their advantages, including excellent high-frequency application performance, a flexibly tunable coefficient of thermal expansion (CTE), low cost, and the ready availability of large-size ultra-thin glass substrates. The metallization process, serving as a critical step in through-glass vias (TGVs), determines the electrical connection performance of integrated chips. Currently, TGV metallization is primarily implemented using physical vapor deposition (PVD) technology. However, the high cost, slow deposition rates, and poor effectiveness of PVD in processing high-aspect-ratio blind and through-holes have drawn widespread attention to wet processes for TGV metallization. Addressing this, the deposition mechanism of TGV electroless plating is elaborated upon, recent research advances and key technologies for enhancing adhesion strength between the electroless plated layer and the glass substrate are reviewed, while insights into future development directions are also provided.

Key words: electroless plating, through glass via, adhesion strength, self-assembled, metal oxide

中图分类号:

TN405.97

孙鹏，钟毅，于大全. 玻璃通孔化学镀金属化研究进展^*[J]. 电子与封装, 2025, 25(7): 070107 .

SUN Peng, ZHONG Yi, YU Daquan. Recent Progress in Electroless Plating Process for Metallization of Through Glass Via[J]. Electronics & Packaging, 2025, 25(7): 070107 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃通孔化学镀金属化研究进展^*

Recent Progress in Electroless Plating Process for Metallization of Through Glass Via

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