基于基板折叠的多面立体封装技术研究进展
毕博1, 2, 潘碑2, 3, 张晋2, 成海峰2, 葛振霆2, 刘子玉1
Research Progress on Substrate Folding-Based Multifaceted 3D Packaging Technology
BI Bo1, 2, PAN Bei2, 3, ZHANG Jin2, CHENG Haifeng2, GE Zhenting2, LIU Ziyu1
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2025.0169
