关键词: 多面立体封装, 传感器, 3D封装, T/R组件, 光电共封

Abstract: Substrate folding-based multifaceted 3D packaging, featuring non-parallel substrates, represents a specialized form of three-dimensional packaging technology with high functional density and superior thermal dissipation capabilities. It demonstrates significant research value across various applications including sensors and medical devices. This paper introduces the concept of substrate folding-based multifaceted 3D packaging and reviews its current research status domestically and internationally. It systematically summarizes the typical architectures, substrate materials, assembly processes, thermal management solutions, and representative applications of the packaging technologies. Emphasis is placed on analyzing the distinctions between substrate folding-based multifaceted 3D packaging and other forms of 3D packaging approaches. The paper explores the unique advantages and salient features of this packaging technology and discusses its development prospects in the field of active phased array T/R modules and Co-packaged optics.

Key words: multifaceted 3D packaging, sensors, 3D packaging, T/R module, Co-packaged optics