光随机源安全芯片封装键合参数优化方法研究
王祥, 李建强, 王晓晨, 马玉松, 薛兵兵, 周斌, 于政强
Research on The Optimization Method of Bonding Wire Parameters
of Optical Random Source security chip Packaging
Wang Xiang, Li Jianqiang, Wang Xiaochen, Ma Yusong, Xue Bingbing, Zhou Bin, Yu Zhengqiang
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0028
