关键词: 光量子安全芯片, 键合线, 正交试验, 结构优化

Abstract:

Optical Random Source security chip device packages are connected between the chip and substrate inside the package by bonding wires to achieve efficient transmission of electronic signals between the inside and outside of the package. Due to its special functional requirements, it is necessary to ensure that the interior of the package is suitable for light transmission. Therefore, transparent filling compound is used inside the package instead of the traditional plastic molding material. However, under operating conditions, the coefficient of thermal expansion of the filling compound is much larger than that of traditional plastic molding materials. The thermal mismatch of the materials inside the package causes large stresses on the bonding wires, which lead to bonding wire stripping and fracture, and ultimately to device failure. In order to ensure the stability and reliability of the optical random source security chip device in the working condition, it is necessary to optimize the package structure of the optical random source security chip to reduce the stress on the bonding wire. In this paper, the effect of the height of the overlay adhesive on the stress on the bonding wire is firstly investigated; then three-factor, three-level orthogonal tests are conducted based on finite element simulation with the height of the bonding wire, the diameter of the bonding wire and the curvature of

Key words: quantum optical security chip, bonding wire, orthogonal test, structure optimization