基于WLCSP封装的应力分析和再布线结构优化
张春颖, 江伟, 刘坤鹏, 薛兴涛, 林正忠
Stress Analysis and Redistribution Layer Structural Optimization Based on WLCSP Packaging
ZHANG Chunying, JIANG Wei, LIU Kunpeng, XUE Xingtao, LIN Zhengzhong
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0031
