中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
大孔径高深径比玻璃通孔的高效高质超级填充
吴恒旭
Efficient and High-Quality Super-Filling of Through Glass Vias with Large Aperture and High Aspect Ratio
电子与封装 . 2025, (10): 100601 .  DOI: 10.16257/j.cnki.1681-1070.2025.0175