有机基板用积层绝缘膜的性能权衡挑战与技术展望
程佳佳1, 鞠苏1, 贺雍律1, 张鉴炜1, 靳启锋1, 吴之涵1, 尹昌平1, 邢素丽1, 李轶楠2, 段科1
Performance Trade-offs in Build-up Dielectric Film for
Organic Package Substrate: Challenges and AI-Enabled Future Directions
CHENG Jiajia1, JU Su1, HE Yonglu1, ZHANG Jianwei1, JIN Qifeng1, WU Zhihan1, YIN Changping1, XING Suli1, LI Yinan2, DUAN Ke1
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0053
