CAK45型片式钽电容力学加固工艺可靠性研究
尹枭雄 , 朱昭君1, 聂磊2, 严中凯1, 李昊宇1, 韩豪威1, 黄龙昌1, 李鑫茹1
Reliability
Study on the Mechanical Reinforcement Process of CAK45 Type Chip Tantalum
Capacitors
YIN Xiaoxiong1, ZHU Zhaojun1, NIE Lei2, YAN Zhongkai1, LI Haoyu1, HAN Haowei1, HUANG Longchang1, Li Xinru1
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0061
