中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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• 封装、组装与测试 •    下一篇

CAK45型片式钽电容力学加固工艺可靠性研究

尹枭雄[1],朱昭君1,聂磊2,严中凯1,李昊宇1,韩豪威1,黄龙昌1,李鑫茹1



  

  1. 1.郑州航空工业管理学院航空发动机学院,郑州  450046;2. 中国科学院长春光学精密机械与物理研究所,长春  130033
  • 收稿日期:2025-11-13 修回日期:2025-12-05 出版日期:2025-12-09 发布日期:2025-12-09
  • 通讯作者: 朱昭君
  • 基金资助:
    河南省高等学校重点科研项目(26A590006);先进耐火材料全国重点实验室开放课题(SKLAR202509)

Reliability Study on the Mechanical Reinforcement Process of CAK45 Type Chip Tantalum Capacitors

YIN Xiaoxiong1, ZHU Zhaojun1, NIE Lei2, YAN Zhongkai1, LI Haoyu1, HAN Haowei1, HUANG Longchang1, Li Xinru1   

  1. 1. School of Aero Engines, Zhengzhou University of Aeronautics, Zhengzhou 450046, China; 2. Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China
  • Received:2025-11-13 Revised:2025-12-05 Online:2025-12-09 Published:2025-12-09

摘要: 本研究针对CAK45型片式钽电容在航空航天振动环境下的可靠性问题,设计了多种型号的钽电容PCB板,并采用GD414硅橡胶进行了多种结构类型点胶加固处理,通过实验与数值仿真相结合的方法,验证了点胶加固工艺的优化与可靠性分析工作。结果表明,多种型号钽电容PCB板在随机和正弦振动输入载荷下,低频阶段振动能量更高,高频衰减明显,但两者响应特征不同。随机振动下,0~100 Hz频段内功率谱密度呈直线上升;100~600 Hz频段内波动显著,易引发电容与PCB板连接处应力集中,从而导致焊点失效以及电容开裂;频率达到600 Hz后功率谱密度开始显著下降。正弦振动频率范围内,沿Y向和沿Z向功率谱密度波动均较为显著,但振动能量主要集中在10~40 Hz低频段,50~70 Hz频段高频衰减显著。正弦振动实验下,B型钽电容PCB板抗Y向振动性能最差,而D型钽电容PCB板抗Y向振动性能最好,H型钽电容PCB板抗Z向振动性能最差。数值仿真结果表明采用GD414硅橡胶对焊点进行点胶加固,可有效提高钽电容抗振性能,并将部分振动应力分散至电路板,从而显著降低焊点所受应力。

关键词: CAK45型片式钽电容器, 点胶加固工艺, 随机振动, 正弦振动

Abstract: This study focuses on the reliability issues of CAK45 chip tantalum capacitors under aerospace vibration environments, and has designed PCB boards incorporating various types of tantalum capacitors, and GD414 silicone rubber was applied for structural reinforcement through dispensing techniques. Experimental and numerical simulation methods validated the optimized dispensing process and reliability. Results indicate that under both random and sinusoidal vibration loads, all tested capacitor-PCB assemblies exhibited higher vibration energy at low frequencies with significant high-frequency attenuation, though their response characteristics differed. During random vibration, the power spectral density (PSD) showed linear increase in the 0-100 Hz range, significant fluctuations between 100-600 Hz causing stress concentration at capacitor-PCB interfaces leading to solder joint failure and capacitor cracking, and substantial decrease beyond 600 Hz. Under sinusoidal vibration, notable PSD fluctuations occurred along both Y and Z directions, with vibration energy concentrated primarily in the 10-40 Hz low-frequency range and pronounced high-frequency attenuation observed between 50-70 Hz. Under sinusoidal vibration, the PCB board with Type B tantalum capacitors exhibits the poorest resistance to Y-direction vibration, while the PCB board with Type D tantalum capacitors shows the best resistance to Y-direction vibration, and the PCB board with Type H tantalum capacitors has the poorest resistance to Z-direction vibration. Numerical simulations confirmed that GD414 dispensing reinforcement effectively enhances capacitor vibration resistance, distributes vibrational stress to the circuit board, and significantly reduces stress on solder joints.

Key words: CAK45 tantalum chip capacitor, potting reinforcement process, random vibration, sinusoidal vibration