低温银烧结技术的可靠性研究进展
王奔1, 朱志宏1, 贾少博1, 汪宝华2, 丁苏1, 李万里1
Research Progress on
the Reliability of Low-Temperature Silver Sintering Technology
WANG Ben1, ZHU Zhihong1, JIA Shaobo1, WANG baohua2, DING Su1, LI Wanli1
电子与封装
.
0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2026.0012
