关键词: 烧结银, 金属化, 老化, 热应力, 可靠性

Abstract: With the rapid development of high-power electronic devices, the operating temperature of chips has been continuously rising. Sintered micro- and nano-silver, due to their excellent conductivity, thermal conductivity, and mechanical strength, have become one of the most promising packaging materials. However, the long-term reliability of sintered silver joints under high-temperature environments and frequent switching conditions has not been fully validated. By summarizing the reliability research on sintered silver joints in high-temperature aging, thermal cycling, thermal shock and power cycling tests, this study systematically explains the material and process reliability of low-temperature silver sintering technology. It deeply analyzes the two key mechanisms that lead to reliability degradation: the thermal driving force effect and thermal stress impact. Through this analysis, the study aims to summarize the current key technical challenges and explore effective strategies to improve the reliability of sintered silver joints.

Key words: sintered silver, metallization layer, aging, thermal stress, reliability