基于边基光滑有限元法的封装模块电热力仿真研究
高方腾, 陈沛, 杨茗勋, 秦飞
Electro-Thermo-Mechanical Simulation of Packaging
Modules via Edge-Based Smoothed Finite Element Method
GAO Fangteng, CHEN Pei, YANG Mingxun, QIN Fei
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0085
