弯液面限域电化学沉积在电子封装领域的应用
卢品静1, 2, 雷雨3, 黄晓龙3, 余四文1, 程昱川1, 任勇2, 郭建军1, 孙爱华1
Application of
Curved-Surface Localized Electrochemical Deposition in Electronic Packaging
LU Pinjing¹, ², LEI Yu³, HUANG Xiaolong³, YU Siwen¹, CHENG Yuchuan¹, REN Yong², GUO Jianjun¹, SUN Aihua¹
电子与封装
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0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2026.0088
