关键词: 弯液面限域电化学沉积, 电化学沉积, 弯液面, 微打印, 电子封装

Abstract: As a novel technology of additive manufacturing, meniscus-confined electrodeposition (MCED) is a kind of three-dimensional printing method that can realize micron or even nanometer-scale metal structures in a confined area under an air environment. The fabrication principle is based on the oxidation-reduction reaction in the micro/nano-scale electrolyte meniscus established between the micropipette tip and the substrate, where the metal ions are reduced into pure metal on the cathode surface. Two-dimensional or three-dimensional complex metal structures can be fabricated in situ by controlling the relative motion between the needle tip and the substrate. The key factors that affect the confined electrochemical deposition in the meniscus are the micropipette tip size, current density, electrolyte composition, microenvironment temperature and humidity, and nozzle moving velocity. This technique has been successfully employed in the fabrication of various functional materials, including copper, nickel, cobalt, and semiconductor sulfides, which hold potential for large-scale applications in areas such as electronic packaging, flexible electronics, and photovoltaic energy. As a core technology integrating microstructure manufacturing with functional integration, it will provide robust technical support for future advanced packaging solutions.

Key words: meniscus-confined electrodeposition, electrochemical deposition, meniscus, micro-additive printing, electronic packaging