热电器件集成电子封装的数值模拟研究：方法、应用与未来方向
张万田, 袁恒, 逯瑶
Numerical Simulation Study on Integrated Electronic
Packaging of Thermoelectric Devices: Methods,
Applications, and Future Directions
ZHANG Wantian, YUAN Heng, LU Yao
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0069
