关键词: 热管理, 电子封装, 热电器件, 界面效应, 数值模拟

Abstract: With the continuous development of electronic devices toward higher power density and miniaturization, thermal management challenges have become increasingly critical. Thermoelectric devices, which possess both waste heat recovery and active cooling capabilities, are considered highly promising energy conversion and thermal management solution for modern compact electronic packaging. Regarding numerical simulation methods for thermoelectric module-integrated electronic packaging, existing studies primarily rely on key techniques such as finite element analysis, multi-physics coupling analysis, and molecular dynamics simulations to investigate and evaluate device performance in thermal management, interfacial reliability, and structural optimization. However, current numerical simulation approaches still face several challenges, including limited model accuracy, high computational cost, and difficulties in capturing multiscale characteristics. Future research could focus on integrating artificial intelligence–assisted simulation and multiscale modeling to further enhance the accuracy and efficiency of thermoelectric module-integrated electronic packaging simulations.

Key words: thermal management, electronic packaging, thermoelectric devices, interface effects, numerical simulation