基于负热膨胀填料研发的电子封装用塑封料
韦豪杰, 江俊杰, 覃飞宇, 孙军, 丁向东, 胡磊
Development of Electronic Packaging Molding Compounds Based on Negative Thermal Expansion Fillers
WEI Haojie, JIANG Junjie, QIN Feiyu, SUN Jun, DING Xiangdong, HU Lei
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0095
