关键词: 先进封装, 负热膨胀, 热膨胀系数, 热失配

Abstract: With the continuous development of advanced packaging technologies toward high frequency, high speed, high integration, miniaturization and high reliability, the problem of thermal expansion mismatch between different materials in packaging structures has become increasingly prominent, triggering risks such as interfacial thermal stress concentration and device failure. Negative thermal expansion (NTE) fillers possess the unique physical property of volume contraction with increasing temperature, providing a potential approach to address the thermal mismatch issue of packaging materials. Combined with the application background and performance requirements of electronic packaging materials, this paper systematically reviews the basic definition, main classification and core characteristics of NTE fillers, sorts out their research and development progress as well as application exploration, focuses on discussing the application potential and development direction of such materials in advanced packaging molding compounds, and prospects their future trends, aiming to provide scientific reference for the research and development of advanced packaging materials.

Key words: advanced packaging, negative thermal expansion materials, coefficient of thermal expansion, thermal mismatch