大尺寸低翘曲2.5D封装倒装焊工艺研究
徐士猛1, 2, 王志慧3, 练滨浩2, 陈昶昊2, 李建中2, 刘弈光3, 栗致浩3, 谢晓辰2, 林鹏荣2, 郭亨通2
Inverted Soldering Process for Large Size Low Warpage
2.5D Packaging
XU Shimeng1, 2, WANG Zhihui3, LIAN Binhao2, CHEN Changhao2, LI Jianzhong2, LIU Yiguang3, LI Zhihao3, XIE Xiaochen2, LIN Pengrong2, GUO Hengtong2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0099
