功率模块生产制程中铜基板翘曲的研究
徐文鑫, 李魏然, 何雪婷, 任卓昌, 刘云鹏, 和香伶, 张亚昆, 刘潇, 汪紫龙
Copper Baseplate Warpage in
Power Module Manufacturing Process
XU Wenxin, LI Weiran, HE Xueting, REN Zhuochang, LIU Yunpeng, HE Xiangling, ZHANG Yakun, LIU Xiao, WANG Zilong
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0092
